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Microchip Technology 1N5711UBCA — Discrete Semiconductors

1N5711UBCA Schottky Diode, 50V 33mA, MIL-PRF-19500/444

MPN1N5711UBCA
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Microchip Technology 1N5711UBCA Schottky diode, MIL-PRF-19500/444 series, 50 V reverse, 33 mA average, 2 pF capacitance, 3-SMD No Lead package, surface mount.

$30.6750Ref. price · indicative, final on quote
Sourced new & surplus through independent channelsAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

1N5711UBCA specifications
ParameterValue
SeriesMilitary, MIL-PRF-19500/444
Diode typeSchottky
MountingSurface Mount
Voltage - DC reverse (Vr)50 V
Voltage - forward (Vf) (Max) @ if1 V @ 15 mA
Current - reverse leakage @ vr200 nA @ 50 V
Current - average rectified33mA
Operating temperature - junction-65°C~150°C
SpeedSmall Signal =< 200mA (Io), Any Speed
PackageBulk
Case3-SMD, No Lead
Capacitance @ vr,2pF @ 0V, 1MHz

Product details

Device identity and military-grade qualification

The 1N5711UBCA is a Schottky diode from Microchip Technology, qualified to MIL-PRF-19500/444 — the military specification for small-signal Schottky diodes. This qualification means the diode has passed screening and reliability testing for defense and aerospace applications, including temperature cycling, burn-in, and hermeticity where applicable. Rated for 50 V reverse voltage and 33 mA average rectified current, it fits signal-level rectification, clamping, and high-speed switching in harsh environments. The junction temperature range of -65°C to 150°C covers military and industrial thermal extremes.

Low capacitance for RF and fast-switching circuits

With 2 pF capacitance at 0 V bias (1 MHz), this diode introduces minimal parasitic loading in RF detector, mixer, and ESD protection circuits. The low capacitance preserves signal integrity at UHF frequencies and above, where a standard rectifier diode would roll off the bandwidth. Forward voltage is 1 V max at 15 mA, typical for a Schottky barrier at this current level. Reverse leakage is 200 nA at 50 V — low enough to avoid significant power loss in high-impedance bias networks.

The UB package (3-SMD, No Lead) is a small surface-mount footprint suited for high-density PCB assembly. The base product number is 1N5711; the UBCA suffix denotes the specific package and screening level within the MIL-PRF-19500/444 family.