LCMXO2-1200UHC-4FTG256I

Lattice Semiconductor Corporation · MachXO2 Series

Lattice Semiconductor MachXO2 FPGA, LCMXO2-1200UHC-4FTG256I, 1280 LEs, 206 I/O, 75 Kbit RAM, 256-FTBGA, -40°C to 100°C, Tray.

Lattice Semiconductor Corporation LCMXO2-1200UHC-4FTG256I
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MOQ 1 · Tray · RoHS · EIA-481 · DAP/DDP · T/T

Technical specifications

LCMXO2-1200UHC-4FTG256I specifications
Parameter / AttributeSpecification / Value
SeriesMachXO2
MountingSurface Mount
Supply voltage2.375V ~ 3.465V
Operating temperature-40°C ~ 100°C (TJ)
PackageTray
Number of i (O)206
Case256-LBGA
Total RAM bits75776
Number of LABs (CLBs)160
Number of logic elements (Cells)1280

Technical details

1280 logic elements — right-sized for glue-logic consolidation

The Lattice LCMXO2-1200UHC-4FTG256I packs 1280 logic elements (160 LABs/CLBs) and 206 I/O into a 256-ball FTBGA package. That I/O count in a 17x17 mm footprint means you can replace a handful of 74-series buffers, address decoders, and bus muxes with a single instant-on, non-volatile device — no external configuration memory, no boot time. The 75 Kbit embedded block RAM handles small FIFOs, look-up tables, or register files without chewing up logic cells. For a glue-logic consolidation play, that is often enough on-chip storage to absorb the handful of state machines and counters that would otherwise live in external SRAM or a small CPLD.

Single-rail supply, industrial temperature — panel-fit checklist

ROHS3 compliant, so no exemption paperwork for EU markets.

Active production — no LTB clock ticking

The MachXO2 family is a mature, widely second-sourced platform — the same 1280-LE fabric appears in multiple package and speed-grade variants. If a future board spin needs a smaller footprint or different I/O count, the core logic migrates with minimal RTL changes.

LCMXO2-1200UHC-4FTG256I
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