32-QFN footprint and board-fit
The LCMXO2-1200HC-6SG32I ships in a 32-UFQFN exposed pad package (5x5 mm body per the supplier device package designation), surface-mount only. This is the smallest footprint in the MachXO2-1200 density tier — compare with the 100-pin TQFP variants (LCMXO2-1200HC-6TG100I) that offer 79 I/O but require a larger board area. The 32-QFN is the right choice when the I/O count fits the design and board space is the constraint.
Logic density and on-chip memory
1280 logic cells arranged in 160 LABs/CLBs give this part roughly 1.2K LUTs — enough for glue logic, state machines, or a small soft-core peripheral bridge. The 64 Kbit (65536 bits) embedded block RAM provides local storage for FIFOs, look-up tables, or configuration registers without external SRAM.
Temperature grade and environment
The 100°C ceiling is the junction limit; the actual case temperature will be lower depending on the board's thermal pad layout and airflow.
Active lifecycle and supply posture
The 32-QFN package is a standard Lattice offering, so lead times typically follow the family's production cycle.