ESR and thermal budget for the rework bench
The TPSY337M006R0150: The 150 mOhm ESR at 100 kHz sets the self-heating under ripple — at 1 A ripple current the internal temperature rise is roughly I² × ESR × Rth, so the part can handle a few hundred mA of AC ripple before the core temperature approaches the 125°C ceiling. Molded case construction means the epoxy body is harder than a conformal-coated chip; the part sits flat on the pad and the termination is a clean solder fillet — rework with hot air at 300°C for 30 seconds lifts the part without lifting the pad, provided the board copper is preheated.
Package footprint and board integration
Manufacturer size code Y means the standard land pattern for a 7343-20 case applies; the anode (+) end is marked by a band on the top of the molded body, which is visible after placement for automated optical inspection.