The TPSW336M016R0175: The capacitance and ESR shift with temperature — at -55°C the ESR roughly doubles, so the ripple current derating must be calculated for cold-start conditions.
W case footprint and board integration
The low profile suits dense PCB layouts where the clearance under a mezzanine board or enclosure lid is tight — the 1.50 mm height leaves room for conformal coating or a stiffener above the component. Surface-mount assembly with tape-and-reel packaging supports automated pick-and-place. The molded construction provides consistent dimensional tolerance and good moisture resistance for reflow soldering — no special handling beyond standard MSL precautions is needed for this tantalum type.
Active lifecycle and supply posture
The TPS series is a broad portfolio; if an alternate footprint or voltage rating is needed, the same W case and 16 V family includes other capacitance values. For BOM hedging, qualify the exact order code — the ±20% tolerance and 175 mOhm ESR are the binding constraints for the decoupling design.