Bulk decoupling in a large molded case
The TPSV108K006R0050: That ESR figure is the key number for a supply-rail decoupling decision: at 100 kHz, a 50 mOhm cap shunts ripple current with about one-fifth the impedance of a 250 mOhm part, so it handles higher-frequency transients before the bulk electrolytic takes over. The 7.30 mm x 6.10 mm footprint and 3.75 mm seated height mean it occupies a substantial board area — plan for a keep-out zone around the part and ensure no tall components overhang the case. The molded body is self-extinguishing per the TPS series standard, which matters for any assembly that must pass UL 94 V-0.
Temperature range and board-fit
The 125°C ceiling also suits hot environments like a motor-drive enclosure or a sealed outdoor telecom power supply. The ±10% tolerance is tight enough for most bulk and filter applications; the capacitance will drift with temperature and DC bias, but for a 1000 µF part the dominant tolerance is the initial ±10% plus aging, not the bias effect. Surface-mount reflow profile follows standard tantalum recommendations — preheat to 150°C, peak at 260°C, and limit time above 217°C to 30 seconds.