68 µF, 6.3 V, 200 mOhm ESR — bulk decoupling on a low-voltage rail
68 µF capacitance at 6.3 V rated voltage with 200 mOhm ESR — this is the parametric triad that determines ripple current handling and transient response for a low-voltage supply rail.
The molded case and surface-mount 2312 (6032 Metric) footprint keep the thermal path consistent across the range.
Manufacturer size code C: 6.00 mm x 3.20 mm footprint, 2.80 mm maximum seated height. The 2312 (6032 Metric) package is a standard tantalum chip size — the PCB land pattern follows the manufacturer's recommended pad geometry for reflow soldering. The molded case provides mechanical protection during pick-and-place and reflow.