Molded tantalum for bulk decoupling and filtering
The molded case provides mechanical protection against vibration and humidity, though conformal coating is still recommended for condensing environments.
Package footprint and board layout
Supplied in 2312 (6032 Metric) case size, manufacturer code C — 6.00 mm x 3.20 mm footprint with a seated height of 2.80 mm max. The surface-mount package reflows on a standard JEDEC profile; the molded body is compatible with lead-free solder processes. No special bake-out is required if the tape is used within the MSL floor life.
