330 µF bulk cap with 35 mOhm ESR floor
The 35 mOhm ESR keeps the impedance low on a power rail — useful for bulk decoupling near a processor or FPGA where the transient current draw is high and the voltage ripple budget is tight.
Temperature range and board fit
In an avionics or downhole application, the capacitance stays within spec across the thermal cycle without the derating that commercial-grade parts require. The 2917 (7343 Metric) case E footprint is a common size — the 7.30 mm x 4.30 mm body fits a standard pad layout with enough copper area to sink the self-heating from ripple current.
The BOM line is stable for ongoing production.