680 µF in a 2924 Molded Case — Bulk Decoupling for Tight Layouts
The TAJV687K006RNJ packs 680 µF ±10% into a molded 2924 (7361 Metric) surface-mount package, giving you high capacitance density for bulk decoupling or hold-up storage on boards where every square millimetre is budgeted. Rated at 6.3 V with a 500 mOhm ESR, the capacitor's self-heating and output ripple are bounded by that ESR floor — for a 1 A ripple current, expect about 0.5 V of ripple and 0.5 W of internal dissipation.
Molded Tantalum — Surface-Mount Fit and Footprint
The molded case in size code V measures 7.30 mm x 6.10 mm with a seated height of 3.75 mm — the 2924 footprint is a standard tantalum outline, compatible with reflow soldering profiles typical for JEDEC MSL-rated components.