22 µF at 50 V — bulk decoupling for harsh environments
The 2924 (7361 Metric) case keeps the inductance low and the solder joint robust for high-reliability assemblies.
Surface-mount footprint and temperature grade
Surface-mount package in the 2924 (7361 Metric) case, size code V. The 7.30 mm x 6.10 mm footprint with a seated height of 3.75 mm fits standard reflow profiles.
