Molded tantalum in a 1206 footprint
With an ESR of 3.5 Ohm, this part sits in the general-purpose decoupling space — adequate for bulk bypass on a 3.3 V or 1.8 V rail, but not a low-ESR option for high-ripple switching regulators. The 22 µF value covers most local decoupling needs for an MCU or small FPGA core supply.
Temperature grade and deployment fit
The molded construction and 1206 package handle the thermal cycling without cracking the body, though the ESR will rise at the cold end.
Availability confirmed at RFQ time.