33 µF, 35 V molded tantalum — BOM-fit note
The molded case (EIA 2917, 7.30 mm × 4.30 mm footprint) is a standard surface-mount form factor; the 4.30 mm seated height fits typical board-to-board clearance in stacked assemblies.
The TAJ series is a mature, widely second-sourced platform; if this exact order code becomes constrained, a functionally equivalent 33 µF, 35 V, ±20%, 500 mOhm ESR tantalum in the same 2917 package from a different manufacturer can be cross-referenced at RFQ.
