150 µF, 10 V, 900 mOhm ESR — bulk decoupling for harsh environments
The molded case provides mechanical protection and consistent footprint for automated assembly.
2917 (7343 Metric) — surface-mount footprint
Housed in the standard 2917 (7343 Metric) case, size code D, the part measures 7.30 mm x 4.30 mm with a seated height of 3.10 mm max. The surface-mount package suits reflow soldering on standard PCB land patterns; the molded body offers good moisture resistance for conformal-coated assemblies.