470 µF at 2.5 V — bulk decoupling for low-voltage rails
The TAJC477K002RNJ delivers 470 µF capacitance at 2.5 V, a combination suited for bulk decoupling on sub-3.3 V power rails — think FPGA core supplies, DDR termination, or processor VDD where the load transient demands a local charge reservoir. The 200 mOhm ESR sets the ripple current ceiling and self-heating rate; at this impedance the capacitor can handle a few hundred mA of ripple before internal temperature rise becomes a derating factor. Rated from -55 to 125 °C, this is a full military-temperature-grade part — it fits avionics power supplies, outdoor telecom base stations, and downhole instrumentation where the ambient swings beyond commercial limits.
TAJC477K002RNJ carries an active product status from KYOCERA AVX, meaning the factory continues to manufacture it and there is no announced end-of-life date.
Case C 2312 — footprint and board fit
The 6.00 mm x 3.20 mm footprint (2312 / 6032 Metric) with a seated height of 2.80 mm fits standard tantalum Case C land patterns — no special pad geometry needed for reflow assembly. Supplied on tape and reel, compatible with automated pick-and-place for high-volume production.