FPGA for high-reliability, wide-temperature designs
The Altera EPF81188GM883B-3 is a FLEX 8000 series FPGA delivering 12000 gates and 1008 logic elements across 126 LABs/CLBs. It operates from a 4.5 V supply and is housed in a CPGA232 ceramic through-hole package — a footprint suited for socketed or soldered mounting on boards that see extreme thermal cycling. The -55°C to 125°C (TC) temperature grade places this part squarely in military, avionics, satellite, and downhole instrumentation applications where commercial-grade plastic packages cannot be risked.
12000 gates, 1008 logic cells — what it means for the BOM
With 12000 gates and 1008 logic elements, this FPGA fits medium-density glue logic, state machines, and simple DSP pipelines. The 126 LAB/CLB count gives a rough floor for how many independent combinatorial or registered blocks fit before the design hits the wall.
CPGA232 through-hole — package realities
The CPGA232 is a ceramic pin-grid array, 232 pins, through-hole mount. It requires a socket or a plated through-hole board — not a reflow-friendly package. The ceramic body handles the full -55°C to 125°C range without the coefficient-of-expansion mismatch that can crack plastic QFPs. Procurement should verify that the board assembly process supports pin-grid arrays; the package is not compatible with standard SMT pick-and-place without a socket carrier.
Sourcing for production and repair
This part is available to order. Availability and current pricing are confirmed at quote time.