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Intel EP4CE75F23C9LN — FPGA / CPLD & Programmable Logic

Intel Cyclone IV E EP4CE75F23C9LN FPGA, 75408 LEs, 292 I/O

MPNEP4CE75F23C9LN
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Intel Cyclone® IV E FPGA, EP4CE75F23C9LN, 75408 logic elements, 292 I/O, 2810880 bits RAM, 484-BGA, 0°C~85°C, tray.

$69.0000Ref. price · indicative, final on quote
StockContact for availability
MOQ1 pcs
  • 100% new & originalTraceable channels only — no refurbs, no pulls, no remarked parts.
  • Date & lot codes on quoteStated per line before you commit; label photos on request.
  • MSL-compliant ESD packingMoisture-sealed bags with indicator cards; reels photo-verified.
  • PayPal buyer protectionPay by T/T, PayPal or Payoneer — card payments covered end to end.

Specifications

EP4CE75F23C9LN Technical Specifications
ParameterValue
SeriesCyclone® IV E
Mounting typeSurface Mount
Voltage0.97V ~ 1.03V
Operating temperature0°C~85°C(TJ)
PackageTray
Number of i (O)292
Case484-BGA
Total RAM bits2810880
Number of LABs (CLBs)4713
Number of logic elements (Cells)75408

Product details

Cyclone IV E FPGA — 75K LE density in a 484-ball BGA

The Intel EP4CE75F23C9LN is a Cyclone® IV E FPGA with 75408 logic elements, 4713 LAB/CLB blocks, and 2810880 bits of embedded RAM in a 484-ball FBGA package. With 292 user I/O and a core supply of 0.97 V to 1.03 V, it targets cost-sensitive, high-volume applications.

What the key ratings mean for the BOM

The 75408 logic elements set the gate-count ceiling. The 292 I/O in a 484-BGA (23x23 mm) gives enough pins for a memory bus or parallel LCD controller. The 2810880 bits of block RAM handle moderate FIFO depths.

Package and mounting — 484-FBGA, 23x23 mm, surface-mount

The 484-ball FBGA (23x23 mm) is a mid-density BGA. The surface-mount package requires a standard reflow profile; no underfill is mandated for commercial-temperature operation.

Provenance and marking — what to check on receipt

The top mark on the EP4CE75F23C9LN reads the base product number EP4CE75, the speed grade (C9), the temperature code (LN for lead-free, commercial), and a date-code lot trace number. The 484-BGA package has a chamfered corner on ball A1.

Frequently asked questions

What is the difference between EP4CE75F23C9LN and EP4CE75F23I7LN?

The C9LN variant is the commercial-temperature grade (0°C to 85°C junction), while the I7LN is the industrial-temperature grade (-40°C to 100°C junction). Both share the same 484-FBGA footprint, same logic density, and same bitstream compatibility. The I7LN is the correct choice for outdoor or factory-floor environments; the C9LN is for indoor, conditioned spaces.

Is EP4CE75F23C9LN RoHS compliant?

The 'LN' suffix in the order code indicates lead-free (RoHS-compliant) finish. This variant uses a lead-free solder ball composition and is compatible with RoHS assembly processes.