What this Cyclone IV E FPGA brings to the board
The Intel EP4CE6E22C8N is a Cyclone® IV E FPGA delivering 6272 logic elements and 91 user I/O in a 144-EQFP package with an exposed pad for thermal relief. It carries 276480 total RAM bits.
I/O count and package — routing constraints at a glance
With 91 I/O brought out to a 144-EQFP (20x20 mm body), the pin density is moderate — no BGA routing complexity, but the exposed pad needs a thermal land on the PCB and a solder-paste stencil opening that matches the datasheet recommendation. The 144-EQFP footprint is common across the Cyclone IV E family, so a board laid out for this package can accept other density variants without a layout change.
Temperature grade — commercial only, not for the engine bay
Rated 0°C to 85°C (junction temperature).
