Logic density and I/O — 55856 LEs, 374 user I/O
The EP4CE55F29C8LN packs 55856 logic elements (3491 LABs/CLBs) and 374 user I/O in a 780-ball FBGA — enough gate budget for a modest video-processing pipeline or a multi-axis motion controller without needing a larger die. On-chip block RAM totals 2396160 bits, so small frame buffers or FIFOs live inside the FPGA rather than chewing up board space and pinout for external SRAM.
Package and board integration — 780-FBGA, 29x29 mm
The 780-ball BGA (29x29 mm body) with 1.0 mm ball pitch is a four-layer-board-friendly footprint — the inner rows fan out without microvias, and the 374 I/O map to eight banks, each with its own VCCIO rail. Core supply is a tight 0.97 V to 1.03 V window — the regulator must hold within 3 % of 1.0 V under load transients, or the FPGA may glitch on a fast clock edge.
The 'LN' suffix indicates lead-free (RoHS-compliant) finish and commercial temp — the same die as the 'C8L' variant but with a different ordering code for the RoHS bill-of-materials declaration.