55,856 logic elements in a 484-BGA
The EP4CE55F23C8N is an Intel Cyclone IV E FPGA packing 55,856 logic elements (LEs) distributed across 3,491 LABs/CLBs, with 324 user I/O brought out to a 484-ball FBGA on a 23 mm square footprint. On-chip block RAM totals 2,396,160 bits — enough for moderate frame buffers or dual-port FIFOs without bolting on external SRAM.
The 484-FBGA (23x23 mm) uses a 1.0 mm ball pitch — a four-layer PCB with via-in-pad or microvias under the BGA is typical for fanning out the inner rows. Surface-mount assembly with a tray-handling profile; the package is moisture-sensitive and should be baked per the MSL label before reflow if the floor-life exposure has been exceeded. Decoupling the 1.15–1.25 V core rail calls for a mix of 100 nF and 10 µF ceramics placed close to the BGA balls — Intel's Cyclone IV power-delivery guidelines recommend one cap per four supply balls on the inner rings.
