What this Cyclone IV E FPGA brings to the board
The Intel EP4CE55F29C7N is a Cyclone® IV E family FPGA packing 55,856 logic elements and 374 user I/O in a 780-ball BGA. It carries 2,396,160 total RAM bits on-chip — enough for moderate FIFO depth or a small frame buffer without tacking on external SRAM. The 1.15 V to 1.25 V core supply keeps power dissipation manageable for a mid-density FPGA, and the commercial temperature range (0°C to 85°C junction) suits it for indoor industrial controllers, test equipment, and communications line cards that live in conditioned racks.
55,856 LEs — where the density lands
At 55,856 logic elements, this part sits in the middle of the Cyclone IV E density stack. The EP4CE75F23C7N steps up to 75,408 LEs and 4,713 LABs/CLBs, but drops to 292 I/O in a smaller 484-ball package — so the trade is gate count versus pin count. If your design needs more than 374 I/O, the 55K LE tier is the ceiling; if you need more logic but can live with fewer pins, the 75K part is the next rung up.
374 I/O in a 780-BGA — fan-out and layout
The 780-ball FBGA (29 mm × 29 mm) with 374 user I/O. The 0°C to 85°C junction temperature rating is commercial grade.