What this FPGA brings to the board
The Intel EP4CE55F23C8 is a Cyclone® IV E FPGA delivering 55,856 logic elements and 2,396,160 bits of embedded block RAM in a 484-ball BGA package. With 324 user I/O, it targets mid-density glue logic, motor-control interface aggregation, and sensor-fusion pre-processing where a soft-core processor or custom datapath replaces a separate MCU. The 1.15 V to 1.25 V core supply keeps dynamic power manageable for fanless industrial enclosures.
Package and I/O – board integration
The 484-BGA (23x23 mm) with 324 I/O demands a four-layer PCB minimum for fanout – six layers if you route the full I/O count. The 0°C to 85°C junction temperature range covers most indoor industrial and telecom environments but not extended outdoor or under-hood automotive. Surface-mount only; no socketed prototyping – plan for a production reflow profile.
Lifecycle and supply position
Intel lists the EP4CE55F23C8 as Active. No last-time-buy notice or NRND flag is published. That means it remains a valid choice for new designs and production replenishment through standard distribution and independent channels. We source and quote this part to order against an RFQ – availability and current pricing confirmed at quote time.