Logic capacity and I/O for the board
The EP4CE55F23C7N: On-chip memory totals 2396160 bits — enough for moderate FIFO or line-buffer storage without external SRAM. The 484-FBGA (23x23 mm) footprint demands careful decoupling and a multi-layer board to fan out the 0.80 mm ball pitch.
Rework and package reality
The commercial temperature grade (0°C to 85°C junction) means the package is rated for indoor equipment, not extended thermal cycling. Pin 1 is marked by a chamfered corner on the package and a corresponding dot on the top — verify orientation before placement because a misaligned BGA is a board-scrap event.
Supply rails and power budget
The 324 I/O banks can run at different VCCIO levels (3.3 V, 2.5 V, 1.8 V, 1.5 V) depending on bank configuration, so the board needs multiple supply rails or a programmable regulator.
