Industrial temperature and package fit
Rated for -40°C to 100°C (TJ), this part handles outdoor telecom cabinets, factory-floor enclosures, and engine-adjacent electronics without a heat sink for moderate utilizations. The 484-FBGA (23x23 mm) footprint requires a multi-layer PCB with via-in-pad or microvia escape routing for the 328 I/O — standard for a BGA of this pitch.
Sourcing and lifecycle — no LTB pressure
Lifecycle status is Active. No last-time-buy or phase-out notice applies. The part is sourced through independent distribution and quoted to order against an RFQ.
