I/O and package — what the 484-BGA means for board layout
The 484-FBGA (23x23 mm) footprint with 328 accessible I/O gives a high pin-to-area ratio. The 0°C to 85°C junction temperature range covers commercial and most industrial ambient environments.
Active lifecycle — no LTB pressure
This part carries an Active product status. That means Intel continues to manufacture it, and there is no announced last-time-buy or end-of-life window. For a BOM line, that removes the urgency to stockpile or qualify a drop-in replacement. Availability is confirmed at quote time through independent distribution; we source and quote it to order against an RFQ.