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Intel EP4CE30F23C6N — FPGA / CPLD & Programmable Logic

Intel EP4CE30F23C6N Cyclone IV E FPGA, 28848 LEs, 328 I/O

MPNEP4CE30F23C6N
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Intel Cyclone® IV E FPGA, EP4CE30F23C6N, 28848 logic elements, 328 I/O, 608256 RAM bits, 484-BGA, tray.

$6.3500Ref. price · indicative, final on quote
Intel EP4CE30F23C6N datasheet (PDF)
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

EP4CE30F23C6N specifications
ParameterValue
SeriesCyclone® IV E
MountingSurface Mount
Supply voltage1.15V ~ 1.25V
Operating temperature0°C~85°C(TJ)
PackageTray
Number of i (O)328
Case484-BGA
Total RAM bits608256
Number of LABs (CLBs)1803
Number of logic elements (Cells)28848

Product details

Logic density and I/O count for the BOM line

The EP4CE30F23C6N: This Cyclone IV E FPGA packs 28,848 logic elements and 1,803 LABs/CLBs, with 608,256 total RAM bits — enough for a moderate-complexity state machine or a soft-core processor with local buffering, without reaching for the next density tier. The 328 user I/O in a 484-BGA package gives you headroom for a wide parallel bus or a bank of peripheral interfaces, but the BGA footprint demands a multi-layer PCB for fan-out — the 23x23 mm body is manageable with standard assembly lines.

The commercial temperature range (0°C to 85°C junction) suits indoor equipment, telecom racks, and lab instrumentation, but not extended outdoor or under-hood environments.

Frequently asked questions

How does EP4CE30F23C6N compare to the EP4CE40F29C8?

The EP4CE40F29C8 offers 39,600 logic elements and 1,161,216 RAM bits — about 37% more logic and 91% more memory — in a larger 484-BGA with 532 I/O. The EP4CE30F23C6N is the right-size choice when the extra density is not needed; the EP4CE40 is the upgrade path if the design outgrows the 28,848 LE budget.