Logic density and I/O for mid-range glue
The EP4CE22F17C8L packs 22320 logic elements in 1395 LABs/CLBs — enough fabric to absorb a moderate peripheral controller, a custom serial interface, or a video timing generator without reaching for a larger die. 153 user I/O in a 256-LBGA gives you headroom for a wide memory bus or a parallel sensor array while leaving pins for debug and configuration. On-chip block RAM totals 608256 bits — enough for a small frame buffer or a coefficient lookup table without external SRAM.
Package, supply, and temperature grade
Housed in a 256-FBGA (17x17 mm) with 1.0 mm ball pitch — a four-layer board with via-in-pad or microvias handles the fan-out cleanly; two-layer breakout is tight on the inner rows. Core supply is 0.97 V to 1.03 V — a tight window that demands a dedicated regulator with ±1.5 % set-point accuracy; the 3.3 V bank supply is separate and more forgiving.
