Logic fabric and on-chip memory
The EP4CE15F23C8N: It packs 15408 logic elements (LEs) arranged in 963 LABs/CLBs, with 516096 total RAM bits distributed across embedded memory blocks. With 343 user I/Os, this device can interface to parallel buses, external memory controllers, and multiple peripheral interfaces without needing a larger package. The 484-ball FBGA (23x23 mm) keeps the footprint compact for a mid-density FPGA.
Supply and temperature envelope
The commercial temperature grade (0°C to 85°C junction) suits controlled indoor environments — telecom racks, industrial controllers, and lab instrumentation — but not extended outdoor or automotive use.
Production status and sourcing
Intel lists the EP4CE15F23C8N as Active (current production). The Cyclone IV E family remains a mainstream mid-density FPGA option for designs that do not require the transceiver count or DSP blocks of the Cyclone V or Arria series. Sourced through authorized and independent distribution channels. No pin-compatible second source from another manufacturer is documented; the BOM position is single-sourced to this Intel order code.