What the EP4CE15F23C8 brings to the board
The Intel EP4CE15F23C8 is a Cyclone IV E FPGA in a 484-ball BGA, delivering 15408 logic elements and 516096 bits of embedded block RAM. With 343 user I/O, it targets medium-density glue logic, display bridging, motor-control interface, and sensor-fusion designs where the I/O count drives the BGA footprint rather than the logic depth. The commercial temperature range (0°C to 85°C) restricts this variant to controlled indoor environments. Supply rail is 1.15 V to 1.25 V core; the 484-BGA (23x23 mm) requires a multi-layer board with via-in-pad or microvia capability for the dense ball array.
Package and physical authentication
The 484-BGA (23x23 mm) is a common Cyclone IV footprint. When inspecting incoming stock, the laser-etch on the package top should read EP4CE15F23C8 with a date-code that traces to Intel's assembly sites.
