Skip to main content
Intel EP4CE10F17C8N — FPGA / CPLD & Programmable Logic
Intel

Intel EP4CE10F17C8N Cyclone IV E FPGA, 10320 LEs, 179 I/O, 256-FBGA

MPNEP4CE10F17C8N
Active

Intel Cyclone IV E FPGA, EP4CE10F17C8N, 10320 logic elements, 179 I/O, 423936 total RAM bits, 645 LABs/CLBs, 1.15V-1.25V supply, 256-FBGA (17x17mm), 0°C to 85°C operating temperature, Tray.

$2.8500Ref. price · indicative, final on quote
EP4CE10F17C8N datasheet
StockContact for availability
MOQ1 pcs
  • 100% new & originalTraceable channels only — no refurbs, no pulls, no remarked parts.
  • Date & lot codes on quoteStated per line before you commit; label photos on request.
  • MSL-compliant ESD packingMoisture-sealed bags with indicator cards; reels photo-verified.
  • PayPal buyer protectionPay by T/T, PayPal or Payoneer — card payments covered end to end.

Specifications

EP4CE10F17C8N Technical Specifications
ParameterValue
SeriesCyclone® IV E
Mounting typeSurface Mount
Voltage1.15V ~ 1.25V
Operating temperature0°C~85°C(TJ)
PackageTray
Number of i (O)179
Case256-LBGA
Total RAM bits423936
Number of LABs (CLBs)645
Number of logic elements (Cells)10320

Product details

What this Cyclone IV E FPGA delivers

The Intel EP4CE10F17C8N is a Cyclone IV E FPGA packing 10320 logic elements and 423936 bits of embedded RAM in a 256-FBGA package. With 179 user I/O and 645 LABs/CLBs, it fits mid-density glue logic, motor drive control bridges, and display interface aggregation where a separate MCU plus CPLD would eat board area. The commercial temperature grade (0°C to 85°C) suits indoor equipment, office peripherals, and telecom line cards — not under-hood or unheated outdoor cabinets.

10320 LEs — what that means for your design

The logic density sits between the Cyclone IV E 6K-class (6272 LEs in the EP4CE6F17C8N) and the 22K-class. For a design currently mapped to a 6K part that is running out of routing headroom, this is the natural step-up in the same 256-FBGA footprint — no board respin needed. The 423936 bits of block RAM handle moderate FIFO depths or small frame buffers without external SRAM.

Package and supply constraints

The 256-FBGA (17x17 mm) requires a multi-layer PCB. Core supply is 1.15 V to 1.25 V; I/O banks can be configured for 3.3 V operation by setting VCCIO.

Frequently asked questions

What is the difference between EP4CE10F17C8N and EP4CE10F17I8N?

The suffix 'C' in EP4CE10F17C8N indicates commercial temperature grade (0°C to 85°C), while the 'I' in EP4CE10F17I8N marks the industrial temperature grade (-40°C to 100°C). Both share the same 10320 logic elements, 179 I/O, and 256-FBGA package.

What is the difference between EP4CE10 and EP4CE6?

The EP4CE10 provides 10320 logic elements and 423936 bits of RAM, while the EP4CE6 offers 6272 logic elements and 276480 bits of RAM. Both are available in the same 256-FBGA package with 179 I/O, making the EP4CE10 a drop-in density upgrade when the 6K-class runs out of logic headroom.

Is EP4CE10F17C8N compatible with 3.3V I/O?

Yes — the I/O banks on this FPGA can be configured for 3.3 V operation by setting the appropriate VCCIO supply voltage. The core runs on 1.15 V to 1.25 V independently of the I/O voltage.

What is the equivalent of EP4CE10F17C8N?

The EP4CE10U14I7N is the industrial-temperature sibling with the same 10320 logic elements and 179 I/O, but in a different package (256-UBGA) and rated for -40°C to 100°C operation. For a pin-compatible commercial-temperature alternative, the EP4CE6F17C8N shares the same 256-FBGA footprint but with fewer logic elements (6272 LEs).