Logic density and memory — sizing the design
The 423936 bits of block RAM handle small FIFOs, coefficient tables, or line buffers. If your application needs more than that, the same package footprint supports the EP4CE6F17C8N (6272 LEs, 276480 bits RAM) for a cost-down, or you step up to a larger density in the same 256-FBGA.
Package and I/O — board integration
The 256-FBGA (17x17 mm) is a fine-pitch BGA. Verify your PCB fab can handle the ball pitch and via-in-pad if you route all 179 I/O. The I/O banks are split across the four edges; check the pinout for bank voltage assignments before laying out the schematic. Surface-mount only — no socket option for this package.
The EP4CE10F17C7 is listed as Active.
