Cyclone III FPGA — 39,600 LE, 535 I/O in a 780-ball BGA
The Altera EP3C40F780C6N is a Cyclone® III FPGA with 39,600 logic elements and 535 user I/Os in a 780-ball FineLine BGA. It operates from a 1.15 V core supply and is specified over the commercial temperature range of 0°C to 85°C junction. This density tier suits medium-complexity logic integration — bridging, parallel processing, or custom I/O expansion — where the 535 I/O count gives board-level routing flexibility across multiple banks.
Logic density and memory — sizing the gate budget
With 39,600 logic elements, 2,475 LAB/CLB blocks, and 1,161,216 total RAM bits, this part fits designs that need moderate distributed memory and combinatorial depth — think image-sensor interface pipelines, motor-control state machines, or protocol bridging. The Cyclone 10 LP peer 10CL040YU484C8G matches the logic-element count and RAM bit total but drops to 325 I/O in a 484-ball package; the EP3C40F780C6N's 535 I/O is the deciding factor when pin count drives the BGA footprint choice.
Active production — no end-of-life concern
The EP3C40F780C6N carries an Active product status. No NRND or last-time-buy notice applies to this ordering code. For BOM-freeze planning, the Cyclone III family remains a supported Altera (Intel) portfolio member; no forced migration is indicated. Sourcing is through independent distribution channels, quoted to order against an RFQ.
Package and mounting — 780-ball FBGA
The 780-ball FineLine BGA is a surface-mount package. Board design must account for the 1.15 V core rail and separate I/O bank voltages — the 535 I/O are distributed across multiple banks, each with its own VCCIO supply. The commercial temperature grade limits the part to controlled indoor environments; no extended-temperature or automotive qualification applies.