FPGA for glue-logic consolidation and I/O expansion
The Intel 10M50DDF256C8G is a MAX 10 series FPGA with 50,000 logic elements and 1,677,312 total RAM bits, housed in a 256-FBGA (17x17) package. It provides 178 user I/O for board-level interfacing and runs on dual supply rails: 2.85 V to 3.15 V and 3.135 V to 3.465 V. The commercial temperature grade (0°C to 85°C) suits controlled indoor environments such as industrial controllers, test equipment, and communications infrastructure.
50,000 logic elements — what it means for the design
The 50,000 logic elements place this part in the mid-range of the MAX 10 family. That density handles moderate state machines, parallel data paths, and custom peripheral interfaces without needing an external CPLD or additional small-logic glue. Paired with 1,677,312 RAM bits, you get enough on-chip storage for frame buffers, FIFOs, or coefficient tables — no external SRAM required for many designs.
Package and I/O planning
The 256-FBGA (17x17 mm) package provides 178 I/O.