50K-logic-element FPGA in a 256-ball BGA
The Intel 10M50DAF256C6G is a MAX® 10 family FPGA packing 50,000 logic elements and 1,677,312 bits of embedded RAM in a 256-ball FBGA footprint. It brings 178 user I/O to the board, enough to interface a parallel ADC bank, a wide memory bus, or a dense sensor array without external muxing. The 1.15 V to 1.25 V core supply and 0 °C to 85 °C commercial temperature range suit it for indoor equipment like industrial controllers, test instrumentation, and communications line cards where the ambient stays inside a controlled rack.
Active production — no EOL concern
The 10M50DAF256C6G carries an Active lifecycle status. No end-of-life notification or last-time-buy window has been issued for this order code. The MAX 10 family remains a current Intel programmable-logic line, so new BOM insertions and production replenishment can proceed without the sourcing risk of a phase-out part.
Package and I/O — board-fit constraints
The 256-ball FBGA measures 17 mm per side. All 178 I/O are available on the BGA balls. The supply rail must hold 1.15 V to 1.25 V.