40K LE FPGA for industrial control and sensor fusion
The Intel 10M40DCF484I6G is a MAX® 10 FPGA with 40000 logic elements and 360 I/O in a 484-BGA package. It has 1290240 bits of embedded RAM.
360 I/O in a 23x23 BGA — routing constraints
The 484-FBGA (23x23 mm) footprint with 360 I/O means the part is pad-limited, not core-limited. Expect dense BGA escape routing: microvias or via-in-pad for the inner rows, and careful pin assignment to avoid layer count creep. The supplier device package is 484-FBGA (23x23) — same mechanical footprint as the 10M40DCF484I7G and 10M40DCF484C8G siblings, so a board layout can be shared across the industrial and commercial temperature grades.
What the 40K LE and 360 I/O mean for the BOM
40K logic elements places this part in the mid-density FPGA tier. The 360 I/O count is high for the density class.
