MAX 10 FPGA — 25K logic elements in a 484-BGA
The Intel 10M25DCF484A7G is a MAX 10 series FPGA with 25,000 logic elements, 360 user I/O, and 691,200 bits of embedded RAM in a 484-ball FBGA package. It operates from a 1.15 V to 1.25 V core supply and is rated for a junction temperature range of -40°C to 125°C, placing it in the extended industrial / automotive-grade tier of the family. The 25,000 LE count gives it enough fabric for moderate glue-logic consolidation, state-machine control, or sensor interface bridging without stepping up to a larger device.
What the ratings mean for the BOM
The 360 I/O count is the first constraint a board designer hits — that many pins on a 23x23 mm BGA forces a multi-layer PCB with fine-trace escape routing. The 691,200 RAM bits are distributed across the fabric as M9K blocks; enough for small FIFOs and look-up tables, but not for frame buffers. The -40°C to 125°C junction temperature rating is the deciding factor for outdoor telecom cabinets, engine-bay electronics, or industrial motor drives where the ambient can push past 85°C — the commercial-grade 10M25DCF484C7G (0°C to 85°C) would not survive that environment.
Active production — no end-of-life pressure
The 10M25DCF484A7G carries an Active lifecycle status. There is no last-time-buy window, no PCN-driven urgency. Sourcing is through standard independent distribution channels; availability and current pricing are confirmed at quote time against an RFQ. No official second-source alternate exists in the MAX 10 family — the 10M25DAF484A7G is a different variant (same logic density and I/O, different ordering code suffix) but not a validated cross-reference. For dual-sourcing planning, verify pin compatibility against your own layout.