Industrial temperature grade and package fit
Rated for -40°C to 100°C junction temperature, the 10M16DCF484I6G suits industrial enclosures. The 484-ball BGA with 23 mm × 23 mm body is a standard footprint for mid-density FPGAs.
Active lifecycle — no LTB pressure
Intel lists this part as Active. No last-time-buy notice or NRND flag is on record.
Comparing I/O count and package variants
The same 16K logic element core appears in several package options. The 10M16DCF484I6G delivers 320 I/O; the 10M16DCF256I6G (256-ball BGA) drops to 178 I/O. If your board has the BGA-484 footprint and you need the full I/O count, this is the correct density tier. The commercial-temperature sibling 10M16DCF484C7G shares the same 320 I/O and 484-BGA but is rated 0°C to 85°C — choose the I6G suffix for the wider industrial range.
