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Intel 10M16DCF256A7G — FPGA / CPLD & Programmable Logic

Intel MAX 10 10M16DCF256A7G FPGA, 16000 LEs, 178 I/O

MPN10M16DCF256A7G
Active

Intel MAX® 10 series, 10M16DCF256A7G, FPGA with 16000 logic elements, 178 I/O, 562176 RAM bits, 1.15V–1.25V core, 256-LBGA, -40°C to 125°C.

$62.9704Ref. price · indicative, final on quote
StockContact for availability
MOQ1 pcs
  • 100% new & originalTraceable channels only — no refurbs, no pulls, no remarked parts.
  • Date & lot codes on quoteStated per line before you commit; label photos on request.
  • MSL-compliant ESD packingMoisture-sealed bags with indicator cards; reels photo-verified.
  • PayPal buyer protectionPay by T/T, PayPal or Payoneer — card payments covered end to end.

Specifications

10M16DCF256A7G Technical Specifications
ParameterValue
SeriesMAX® 10
Mounting typeSurface Mount
Voltage1.15V ~ 1.25V
Operating temperature-40°C ~ 125°C (TJ)
PackageTray
Number of i (O)178
Case256-LBGA
Total RAM bits562176
Number of LABs (CLBs)1000
Number of logic elements (Cells)16000

Product details

What this MAX 10 FPGA brings to the board

The Intel 10M16DCF256A7G is a MAX 10 FPGA packing 16000 logic elements and 178 I/O in a 256-ball FBGA. It sits in the sweet spot for medium-density glue logic, sensor fusion, or motor-control interface — enough LEs to absorb a few state machines and a parallel bus without reaching for a bigger die. The 562176 RAM bits give you room for small FIFOs or look-up tables on-chip. Operating temperature spans -40°C to 125°C junction.

Package and mounting — what the 256-FBGA means on the line

The 256-FBGA (17x17 mm) is a surface-mount BGA. On a pick-and-place line it handles fine — standard solder paste, reflow profile per JEDEC. But for field swap or rework, you need a hot-air station and a stencil; this is not a socketed part you pop in with a screwdriver. Board layout needs via-in-pad for the centre balls if you route all 178 I/O out.

Lifecycle and sourcing — active, no LTB clock ticking

Sourced through independent distribution; pricing and lead time confirmed at quote time against an RFQ.

Frequently asked questions

What is the closest functional second-source for 10M16DCF256A7G?

The 10M16DCF256I7G is the same die and package, same 16000 LEs and 178 I/O, but its temperature range is -40°C to 100°C (TJ) instead of 125°C. If your application does not need the full 125°C rating, the I7G is a drop-in alternative for dual-sourcing.

What is the difference between MAX 10 and Cyclone 10?

MAX 10 is a non-volatile FPGA family with instant-on configuration (like a CPLD) and integrated ADC blocks, targeting low-power, single-chip applications. Cyclone 10 is a higher-density, SRAM-based FPGA family that requires an external configuration device and targets higher-performance logic and DSP tasks. The 10M16DCF256A7G is a MAX 10 part.