What this MAX 10 FPGA brings to the board
The Intel 10M16DCF256A7G is a MAX 10 FPGA packing 16000 logic elements and 178 I/O in a 256-ball FBGA. It sits in the sweet spot for medium-density glue logic, sensor fusion, or motor-control interface — enough LEs to absorb a few state machines and a parallel bus without reaching for a bigger die. The 562176 RAM bits give you room for small FIFOs or look-up tables on-chip. Operating temperature spans -40°C to 125°C junction.
Package and mounting — what the 256-FBGA means on the line
The 256-FBGA (17x17 mm) is a surface-mount BGA. On a pick-and-place line it handles fine — standard solder paste, reflow profile per JEDEC. But for field swap or rework, you need a hot-air station and a stencil; this is not a socketed part you pop in with a screwdriver. Board layout needs via-in-pad for the centre balls if you route all 178 I/O out.
Lifecycle and sourcing — active, no LTB clock ticking
Sourced through independent distribution; pricing and lead time confirmed at quote time against an RFQ.
