178 I/O in a 17×17 mm footprint
The 256-FBGA (17×17 mm) body provides 178 I/O. Surface-mount package is standard for reflow assembly.
Commercial temperature range — indoor use only
Rated 0°C to 85°C (TJ), this variant is for conditioned environments — factory-floor cabinets with active cooling, office equipment, or lab instrumentation. For outdoor telecom or under-hood automotive, the industrial-temperature sibling 10M08DCF256A7G covers -40°C to 125°C (TJ) in the same 256-FBGA footprint. The 10M08DAF256C7G shares the same 0°C to 85°C range and 178 I/O but uses a different package code (AF vs CF); verify pin compatibility before substituting.
Sourcing and BOM fit
This part is sourced to order against an RFQ through independent distribution. Availability and current pricing are confirmed at quote time. The 178 I/O count and 8K logic elements fit BOM lines where a small FPGA handles display timing, sensor fusion, or protocol bridging — not a high-end compute fabric, but a reliable instant-on logic engine for production hardware.
