178 I/O in a 17×17 mm footprint
The 256-FBGA (17×17 mm) body provides 178 I/O. Surface-mount package is standard for reflow assembly.
Rated 0°C to 85°C (TJ), this variant is for conditioned environments — factory-floor cabinets with active cooling, office equipment, or lab instrumentation. For outdoor telecom or under-hood automotive, the industrial-temperature sibling 10M08DCF256A7G covers -40°C to 125°C (TJ) in the same 256-FBGA footprint.
The 178 I/O count and 8K logic elements fit BOM lines where a small FPGA handles display timing, sensor fusion, or protocol bridging — not a high-end compute fabric, but a reliable instant-on logic engine for production hardware.
