MAX 10 FPGA — 8,000 logic elements in a 256-ball BGA
The Intel 10M08DAF256C8GES is a MAX® 10 family FPGA with 8,000 logic elements and 500 LABs/CLBs, delivering 387072 bits of embedded RAM. Its 178 user I/Os route through a 256-LBGA package (17x17 mm FBGA footprint), making it a dense option for board-level glue logic, sensor fusion, or display interface bridging in commercial-temperature equipment (0°C to 85°C junction).
Lifecycle reality — eol_hot flag
The lifecycle stage is marked eol_hot, which signals an active end-of-life process. The official product status remains Active per the manufacturer, but the eol_hot flag means a last-time-buy window may be open or closing. If this part is in your BOM, now is the time to secure lifetime buy quantities or qualify a drop-in. The base product number 10M08DAF256 covers the same die in different speed/temp grades — the 10M08DAF256C7G (same package, same I/O, same RAM, same temp range) is a functional equivalent if you can tolerate the speed-grade difference. No official second-source exists outside the MAX 10 family.
Package and storage
Surface-mount 256-LBGA, supplied in Tray. The 17x17 mm body is standard for this density tier.
