Intel MAX 10 series, 10M04DAF256C8G, 4000 logic elements, 178 I/O, 193536 total RAM bits, 1.15V–1.25V supply, 0°C to 85°C operating temperature, 256-FBGA package.
| Parameter | Value |
|---|---|
| Series | MAX® 10 |
| Mounting | Surface Mount |
| Supply voltage | 1.15V ~ 1.25V |
| Operating temperature | 0°C ~ 85°C (TJ) |
| Package | Tray |
| Number of i (O) | 178 |
| Case | 256-LBGA |
| Total RAM bits | 193536 |
| Number of LABs (CLBs) | 250 |
| Number of logic elements (Cells) | 4000 |
With 4000 logic elements and 250 LABs/CLBs, this part fits glue-logic consolidation and small state machines. The 193536 bits of embedded RAM handle FIFO buffers.
For procurement, that translates to stable lead times and no forced redesign window.
Buyers need to know delivery schedule to avoid production delays.
Stock availability directly impacts ability to procure quickly for BOM fulfillment.
Design engineers need to verify fit: logic elements, I/O count, voltage, temperature range.
Maintenance techs need to know if the part is directly drop-in compatible without redesign.
Thermal and power budget constraints are critical for embedded and industrial designs.
Sourcing buyers require authorized distributor channels for price negotiation and warranty.