4000 LEs — sizing the logic budget
With 4000 logic elements and 250 LABs/CLBs, this part fits glue-logic consolidation and small state machines. The 193536 bits of embedded RAM handle FIFO buffers.
Active production — no LTB pressure
The 10M04DAF256C8G carries an Active lifecycle status, meaning Intel continues to manufacture it without a last-time-buy notice. For procurement, that translates to stable lead times and no forced redesign window. The closest functional sibling is the 10M04DAF256A7G — same logic density and I/O count, but rated for -40°C to 125°C (TJ) instead of commercial temperature, making it the drop-in for extended-temperature builds if your supply chain can tolerate the upcharge.
