130 I/O and 2000 LEs — what the fabric delivers
The 2000 logic elements and 125 LABs/CLBs handle moderate-density combinatorial and sequential logic. The 130 I/O in the 169-UBGA package provides enough pins to connect parallel buses, multiple SPI or I2C peripherals, and a parallel LCD interface without external muxing. The 110592 total RAM bits support small FIFOs, look-up tables, or line buffers for video scaling up to VGA resolution.
Industrial temperature grade — where it runs
The lifecycle stage is eol_hot, meaning Intel has flagged this part for end-of-life. The product status remains Active, but the eol_hot signal indicates that a last-time-buy window is open or imminent.