130 I/O and 2000 LEs — what the fabric delivers
The 2000 logic elements and 125 LABs/CLBs handle moderate-density combinatorial and sequential logic. The 130 I/O in the 169-UBGA package provides enough pins to connect parallel buses, multiple SPI or I2C peripherals, and a parallel LCD interface without external muxing. The 110592 total RAM bits support small FIFOs, look-up tables, or line buffers for video scaling up to VGA resolution. For a design that fits these resources, this part eliminates the need for a separate CPLD and SRAM.
Industrial temperature grade — where it runs
Rated for -40°C to 100°C junction temperature, the 10M02SCU169I7G is specified for unheated enclosures, engine-bay-adjacent electronics, and outdoor base-station backhaul cards. The commercial-grade sibling 10M02SCU169C8G is limited to 0°C to 85°C, so the I7G is the pick for designs that must survive cold starts or hot-side airflow.
Lifecycle and sourcing — where this part sits in the cycle
The lifecycle stage is eol_hot, meaning Intel has flagged this part for end-of-life. The product status remains Active, but the eol_hot signal indicates that a last-time-buy window is open or imminent.
