Rated for 500 V drain-source and 11.6 A continuous drain current at 25 °C case temperature, it targets hard-switching topologies in offline power supplies, power-factor-correction stages, and lighting ballasts where 500 V blocking and low conduction loss are required. The through-hole TO-262 package (PG-TO262-3-1) suits designs that need a soldered-in device with good thermal transfer to the heatsink via the exposed tab.
For BOM planning, this part is a straightforward line item — no LTB date to track, no forced redesign horizon.
