256 Mbit parallel NOR Flash — active, industrial-temp, 64-FBGA
The Infineon (formerly Cypress) S29GL256S10DHV020 is a 256 Mbit parallel NOR Flash memory from the GL-S series, organized as 16M x 16 bits. Packaged in a 64-ball FBGA, this is a surface-mount, parallel-interface device intended for code shadowing, execute-in-place (XIP), and firmware storage in industrial, automotive, and embedded systems where extended temperature tolerance and fast random read are required.
The 100 ns access time defines the maximum delay from address assertion to valid data on the bus. For a 16-bit parallel NOR Flash used in XIP, this directly sets the read cycle time.
The 105°C ceiling is 20°C higher than the standard commercial/industrial 85°C limit, making it a candidate for engine-bay modules, solar inverters, and high-ambient industrial controllers.
Package and mounting — 64-FBGA
The 64-ball FBGA (Fine-pitch Ball Grid Array) is a surface-mount package. The ball pitch is 0.8 mm, which is a common footprint for mid-density NOR Flash. No exposed thermal pad — the package dissipates through the BGA balls and PCB copper. Standard MSL 3 handling applies: bake before reflow if the moisture-barrier bag has been open beyond the floor-life window.