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Infineon Technologies S29GL256P90FFIR10 — Logic ICs

S29GL256P90FFIR10 256Mbit Parallel NOR Flash, 90 ns, 64-FBGA

MPNS29GL256P90FFIR10
End of Life

Cypress GL-P series S29GL256P90FFIR10, 256Mbit Parallel NOR Flash, 90 ns access time, 2.7V-3.6V supply, 64-LBGA (13x11 mm), -40°C to 85°C, Tray.

$9.82Ref. price · indicative, final on quote
Packaging64-LBGA
RoHSROHS3 Compliant
SeriesGL-P
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

S29GL256P90FFIR10 specifications
ParameterValue
SeriesGL-P
Memory typeNon-Volatile
MountingSurface Mount
Supply voltage2.7V ~ 3.6V
Memory interfaceParallel
Operating temperature-40°C ~ 85°C (TA)
PackageTray
TechnologyFLASH - NOR
Access time90 ns
Memory size256Mbit
Memory formatFLASH
Case64-LBGA
Memory organization32M x 8
Write cycle time - word, page90ns

Product details

256 Mbit parallel NOR Flash in a 64-ball BGA

The Cypress S29GL256P90FFIR10 is a 256 Mbit parallel NOR Flash memory from the GL-P series, organized as 32M x 8 bits.

90 ns access time — bus timing margin

For a host controller running at, say, 50 MHz (20 ns period), a 90 ns read access means the controller must insert at least four wait states to meet the setup time. That is typical for parallel NOR Flash of this density; the trade-off is simpler interface logic versus the faster page-mode or burst reads available on some newer parts. If your design already uses a 100 ns or slower Flash, this part drops in with margin to spare.

256 Mbit density — firmware and data-logging headroom

256 Mbit (32 MB) is a common density for storing bootloaders, RTOS images, file systems, and configuration data in industrial and networking equipment. It provides enough room for a primary firmware image plus a fallback recovery image, or for several months of data-logging in a sensor node. The parallel interface means the host reads it like a memory-mapped device — no SPI command overhead — which simplifies firmware bring-up and reduces latency for random-access reads.

The 2.7V minimum supply gives headroom for a 3.3V rail that droops during cold-crank or brownout events. If your system sees sustained junction temperatures above 85°C, you would need to step up to the 105°C or 125°C rated variants in the GL family.

64-ball FBGA — layout and rework considerations

For rework, a hot-air profile with bottom-side preheat is standard; the 13x11 mm body is manageable with a standard rework station.

For dual-sourcing resilience, the GL-P series has pin-compatible siblings at other densities (128 Mbit, 512 Mbit) that share the same 64-ball FBGA footprint and interface, though the access time and supply voltage may differ — verify the specific variant before substituting.

Frequently asked questions

What is the difference between S29GL256P90FFIR10 and S29GL256P90FFIR13?

The difference is the shipping medium: the FFIR10 suffix indicates Tray packaging, while the FFIR13 suffix indicates Tape & Reel. The die, package, and electrical specifications are identical.

Can S29GL256P90FFIR10 replace S29GL256P90TFIR10?

The S29GL256P90TFIR10 is a functionally identical part in a different package (TSOP versus FBGA). The FFIR10 is a 64-ball FBGA; the TFIR10 is a 56-pin TSOP. They are not footprint-compatible, so a board redesign is required to swap between them.