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Infineon Technologies S29GL256P10FFI022 — Memory (DRAM / SRAM / Flash / EEPROM)

S29GL256P10FFI022 256 Mbit Parallel NOR Flash, 100 ns, GL-P

MPNS29GL256P10FFI022
Active

Infineon (Cypress) GL-P series, S29GL256P10FFI022, 256 Mbit parallel NOR flash, 100 ns access time, 2.7 V supply, 32M x 8 organization, -40°C to 85°C, 64-FBGA, Tape & Reel.

$11.95Ref. price · indicative, final on quote
StockContact for availability
MOQ1 pcs
  • 100% new & originalTraceable channels only — no refurbs, no pulls, no remarked parts.
  • Date & lot codes on quoteStated per line before you commit; label photos on request.
  • MSL-compliant ESD packingMoisture-sealed bags with indicator cards; reels photo-verified.
  • PayPal buyer protectionPay by T/T, PayPal or Payoneer — card payments covered end to end.

Specifications

S29GL256P10FFI022 Technical Specifications
ParameterValue
SeriesGL-P
Interface_typeParallel
Mounting_typeSurface Mount
Operating temperature high-40°C to 85°C (TA)
Frame_size256Mbit
Access time100 ns
Memory_typeNon-Volatile
Package_typeTape & Reel (TR)
Memory formatFLASH
Product_statusActive
Supply_voltage_v2.7
Memory organization32M x 8
Write cycle time - word, page100ns

Product details

256 Mbit parallel NOR flash for code and data storage

The Infineon (formerly Cypress) S29GL256P10FFI022 is a 256 Mbit parallel NOR flash memory from the GL-P series, organized as 32M x 8 bits. Typical applications include industrial controllers, networking equipment, and telecom infrastructure where the parallel bus simplifies integration with legacy MCUs or FPGAs that lack a serial-flash controller.

100 ns access — timing margin for the parallel bus

The 100 ns access time sets the window for the MCU or FPGA to latch valid data after asserting the address and chip-enable. The page-program write cycle also runs at 100 ns per word.

The GL-P series has been a workhorse in the Infineon NOR flash portfolio, and active status suggests continued manufacturing support for the foreseeable future.

64-ball FBGA — footprint and rework considerations

Packaged in a 64-ball FBGA (Fine-pitch Ball Grid Array), this part uses a surface-mount footprint that requires standard BGA reflow profiling. The Tape & Reel (TR) packaging suits automated pick-and-place assembly. For rework or replacement in the field, the BGA package calls for a hot-air station with a nozzle sized to the 64-ball array and a pre-bake step per MSL requirements — the FBGA construction is moisture-sensitive, so the floor-life window after opening the sealed bag must be respected to avoid popcorning during reflow.

Frequently asked questions

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What is the datasheet for S29GL256P10FFI022?

Design engineers need the full datasheet to validate pin compatibility, timing, and electrical characteristics.

What is the price of S29GL256P10FFI022?

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Is S29GL256P10FFI022 obsolete or end-of-life?

Brokers and long-term planners need lifecycle status to avoid supply disruptions and plan for alternate sourcing.

What is a direct replacement for S29GL256P10FFI022?

Maintenance techs need drop-in replacements to quickly repair failed units without redesign.

How long is the lead time for S29GL256P10FFI022?

Buyers need accurate lead time to align with production schedules and avoid project delays.