Skip to main content
Infineon Technologies S29GL128S90DHI020 — Logic ICs

S29GL128S90DHI020 128Mbit Parallel NOR Flash, 90 ns, FBGA-64

MPNS29GL128S90DHI020
End of Life

Infineon GL-S series S29GL128S90DHI020, 128Mbit (8M x 16) Parallel NOR Flash, 90 ns access time, 2.7V to 3.6V supply, -40°C to 85°C, 64-FBGA (9x9 mm), Tray.

$5.47Ref. price · indicative, final on quote
Packaging64-LBGA
RoHSROHS3 Compliant
SeriesGL-S
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

S29GL128S90DHI020 specifications
ParameterValue
SeriesGL-S
Memory typeNon-Volatile
MountingSurface Mount
Supply voltage2.7V ~ 3.6V
Memory interfaceParallel
Operating temperature-40°C ~ 85°C (TA)
PackageTray
TechnologyFLASH - NOR
Access time90 ns
Memory size128Mbit
Memory formatFLASH
Case64-LBGA
Memory organization8M x 16
Write cycle time - word, page60ns

Product details

128 Mbit parallel NOR flash for code shadowing and execute-in-place

The Infineon S29GL128S90DHI020 is a 128 Mbit parallel NOR flash memory from the GL-S series, organized as 8M x 16 bits. It is designed for embedded systems that need fast, random-access code storage — typically for execute-in-place (XIP) firmware, boot loaders, and configuration data in industrial controllers, networking gear, and automotive infotainment. The 90 ns access time defines the read cycle: the host controller can pull data every 90 ns in a page mode burst, which keeps the bus moving without wait states for most 16-bit MCUs and FPGAs at moderate clock speeds.

For a 16-bit wide memory, that translates to a maximum read bandwidth of roughly 22 MB/s in random access, higher in page or burst modes. This is fast enough to feed a 100 MHz ARM or RISC-V core without wait states if the flash is mapped into the code space, but a 200 MHz+ core will need a cache or a higher-speed serial flash. The write cycle time — 60 ns for word and page writes — is separate and governs programming speed; page writes let you load a buffer and commit in one cycle, which improves firmware update throughput.

Package and footprint: 64-FBGA (9x9 mm)

The S29GL128S90DHI020 comes in a 64-ball Fine-Pitch Ball Grid Array (FBGA) package measuring 9 mm x 9 mm. The 0.8 mm ball pitch is standard for this density and is routable on a 4-layer board with via-in-pad techniques. The 64-LBGA footprint is shared with other GL-S density variants, so a board layout can be reused across 64 Mbit to 512 Mbit options without a respin.

The industrial temperature range is the most common specification for equipment that sees seasonal extremes but not under-hood heat. Storage temperature exceeds the operating range — handling and soldering, not running, is what that limit governs.

If you need a drop-in alternative, the S29GL128S10TFIV13 (100 ns access, same density and package) is a functional cross-reference — slightly slower, but pin-compatible and often available when the 90 ns grade is tight.

Frequently asked questions

What is the replacement or equivalent for S29GL128S90DHI020?

It is pin-compatible and can serve as a second source or substitute when the 90 ns grade is unavailable.

Is S29GL128S90DHI020 RoHS compliant?

Yes, it is ROHS3 compliant, covering all ten restricted substances including the four phthalates (DEHP, BBP, DBP, DIBP).