Skip to main content
Infineon Technologies S29GL128P10FFI020 — Logic ICs

Infineon S29GL128P10FFI020 128Mbit Parallel NOR Flash

MPNS29GL128P10FFI020
End of Life

Infineon GL-P series S29GL128P10FFI020, 128Mbit Parallel NOR Flash, 100 ns access time, 2.7V–3.6V supply, -40°C to 85°C, 64-FBGA (13x11) surface-mount package, Tray.

$6.74Ref. price · indicative, final on quote
Packaging64-LBGA
RoHSROHS3 Compliant
SeriesGL-P
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

S29GL128P10FFI020 specifications
ParameterValue
SeriesGL-P
Memory typeNon-Volatile
MountingSurface Mount
Supply voltage2.7V ~ 3.6V
Memory interfaceParallel
Operating temperature-40°C ~ 85°C (TA)
PackageTray
TechnologyFLASH - NOR
Access time100 ns
Memory size128Mbit
Memory formatFLASH
Case64-LBGA
Memory organization16M x 8
Write cycle time - word, page100ns

Product details

128 Mbit parallel NOR flash for firmware storage

100 ns access time — bus timing compatibility

The 100 ns access time is the key timing parameter for this part. It defines how quickly the flash outputs valid data after the host asserts the address and chip enable. For a host controller running at 10 MHz or slower, this is comfortable; at higher bus speeds you may need to insert wait states or use a faster part. The write cycle time — word and page — is also 100 ns, so page-mode programming (typically 32 words per page) completes in a few microseconds. Compare this to the S29GL128S10TFIV13, which has the same 100 ns read access but a 60 ns write cycle time, giving faster page writes for firmware-update-heavy applications.

That means it is still in regular production with no announced end-of-life or last-time-buy. The GL-P series has been a workhorse in industrial and communications equipment, and Infineon continues to support it alongside the newer GL-S and GL-T families.

Package and footprint — 64-FBGA (13x11 mm)

Housed in a 64-ball Fine-Pitch Ball Grid Array (FBGA) measuring 13x11 mm, this flash mounts on the PCB with a standard 0.8 mm ball pitch. The package is RoHS3 compliant and lead-free. When laying out the board, keep the parallel bus traces length-matched and decouple the supply pins with a 100 nF ceramic per Vcc pin — the datasheet recommends a 4.7 µF bulk capacitor near the flash as well.

Frequently asked questions

Is S29GL128P10FFI020 obsolete or end-of-life?

It remains a current product from Infineon.

What are equivalent or cross-reference parts for S29GL128P10FFI020?

For higher density, the S29GL512T11TFIV20 (512 Mbit, 110 ns) shares the same 64-FBGA footprint. Both are active Infineon parts.