48-FBGA footprint and board integration
The S29AL016J70BFI012 comes in a 48-VFBGA package with a 8.15x6.15 mm body (48-FBGA). The 0.50 mm ball pitch demands a controlled-impedance breakout on a 4-layer board; the inner layers carry the address and data bus routing to the host controller without via stubs that would reflect the 70 ns access edge. Surface-mount assembly with the standard JEDEC moisture sensitivity level for thin FBGA packages — bake before reflow if the floor life has been exceeded. The 48-ball array distributes the I/O, supply, and ground pins evenly, so the decoupling capacitors sit directly under the package on the opposite side of the board.
16 Mbit parallel NOR with 70 ns access
Organised as 2M x 8 or 1M x 16 via the byte-wide select pin, the 16 Mbit array is accessed through a full parallel address/data bus. The write cycle time per word or page is 70 ns, matching the read access, so the firmware update routine does not need separate timing parameters for program operations.
Active lifecycle and compliance
The AL-J series is a mature parallel NOR flash family with a long production history.