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Infineon Technologies S26KL128SDABHI030 — Memory (DRAM / SRAM / Flash / EEPROM)

S26KL128SDABHI030 Infineon HyperFlash 128 Mbit NOR, 96 ns

MPNS26KL128SDABHI030
Active

Infineon HyperFlash™ KL series, 128 Mbit parallel NOR flash, S26KL128SDABHI030, 96 ns access time, 100 MHz clock, 2.7 V supply, -40 to 85 °C industrial, 24-ball FBGA.

$4.86Ref. price · indicative, final on quote
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

S26KL128SDABHI030 specifications
ParameterValue
SeriesHyperFlash™ KL
InterfaceParallel
MountingSurface Mount
Operating temperature high-40°C to 85°C (TA)
Frame_size128Mbit
Access time96 ns
Memory typeNon-Volatile
Frequency100000000.0
Package_typeBulk
Memory formatFLASH
StatusActive
Supply voltage2.7
Memory organization16M x 8

Product details

The S26KL128SDABHI030: This part is safe to specify into new designs and production builds without an obsolescence-driven respin.

128 Mbit parallel NOR flash — what the access time and clock mean for the bus

The S26KL128SDABHI030 is a 128 Mbit parallel NOR flash from Infineon's HyperFlash KL family, organised as 16M x 8 bits. The 96 ns access time sets the random-read latency — the time from address assertion to valid data on the bus — which governs how quickly the CPU can fetch the first word from a random location. Once the initial access completes, the 100 MHz clock rate sustains page-mode reads at the bus bandwidth. The parallel interface connects directly to a microcontroller or application processor's external memory bus without a serial-to-parallel bridge.

Industrial temperature grade — -40 to 85 °C ambient

The 24-ball FBGA package (0.80 mm ball pitch) is a surface-mount footprint that requires a standard reflow profile; no special underfill is needed for the temperature range.

Frequently asked questions

What compliance documentation does Infineon provide for S26KL128SDABHI030?

Infineon provides RoHS and REACH compliance declarations for the HyperFlash KL series. The part is halogen-free and meets the EU RoHS exemption criteria for lead in solder joints. No UL or IEC certification is listed for this memory component — those standards apply to the end-equipment, not the flash die itself.